Squink is a personal factory creating a seamless experience that allows you to prototype faster and affordably while producing repeatable and reliable results without all the mess and complication.
It uses three interchangeable heads to get the job done, all in a one simple machine that fits on your desk. Welcome to the era of "Rapid Prototyping"!
Using inkjet technology, Squink prints conductive ink on a surface to create the traces of the circuit. You can print GERBER RS-274X files or upload PNG, JPG or BMP files. The intuitive web interface will guide you through the process letting you print complex circuits in a matter of minutes.
Squink uses the soldermask file generated by your CAD tool to place dots of conductive glue or solder paste in every connection point where a part is to be placed. Squink will be able to determine how many dots are required, depending on the size of each pad.
Aimed at assembling SMD based circuits, Squink uses the "Centroid and Rotation" file created in your CAD tool. By means of vacuum, it picks components from a tray, corrects alignment and rotation using the onboard computer vision and places the components in the correct spot.
Each component is picked from a tray, not a rail, so the setup of the machine is as simple as it gets. Up to 20 slots can be configured per job, allowing for automated assembly without the complexity of large industrial machines.
Squink Picking and Placing SMD capacitors on a traditional multilayer board - in fact, the very PCB Squink uses. By some measure, Squink is a self-replicating machine.
|Number of Layers||
|Maximum Circuit Size||6" x 6"|
|Minimum Feature Size (Line Width)||20 mil (0.254 mm), 20mill (0.508 mm) recommended|
|Minimum Line Spacing||15 mil (0.254 mm), 20mill (0.508 mm) recommended|
|Minimum Package Size||
0603 (in) for two terminal packages (Resistors, Capacitors, etc)
SOIC for ICs.
Automatic placing of through-hole components is not supported at the moment.
50 mOhms/sq as measured
17.5 x 17.5 x 15in (45 x 45 x 38cm)
30 lb (13.6kg)
|Supported Materials Standard Ink||
Photopaper, coated transparency film and coated Kapton.
|Supported Materials Advanced Ink||
Non-Porous materials: Paper, glass, plastic, FR4
(Advanced ink is under development)
Total Time of Assembly
(4"x 4" board, 15 elements)
|Around 30 minutes|
Calculated Cost of Fabrication:
(no components included)
(4"x 4" board, 15 elements)
|US$5 or less|
Maximum and Recommended Currents for Various Trace Widths (Silver ink on Photopaper substrate)
|Width||Max Current @5V||Recommended Current @5V|
|10 mil (0.25 mm)||380 mA||250 mA|
|20 mil (0.5 mm)||650 mA||455 mA|
|30 mil (0.75 mm)||900 mA||630 mA|
|40 mil (1 mm)||1.2 A||840 mA|
|50 mil (1.25 mm)||1.4 A||980 mA|
|100 mil (2.5 mm)||1.8 A||1.26 A|