Research into new Bonding Solutions

BotFactory is all about improvement - we are looking into a new solution for bonding components to printed traces on flexible or rigid materials that is significantly stronger, more reliable, higher precision and faster than existing market solutions.

This solution would be a new accessory product that we'd be selling alongside each PCB Printer and your responses will help us accelerate development and release into the market.

All of your responses will be confidential. We'd appreciate your honest answers and if possible, we'd like to have a short follow-up call with you to make sure we understand everything you share. 

Thank you! 

-BotFactory Team

Customer Info

Name *

Company *

Position *

Current Bonding Process

In your workplace, do you use a bonding process other than solder paste? *

If yes, why do you use this alternative bonding process?

What kind of bonding materials are you using? *

Can you give us any details on challenges with the current processes? *

What kind of substrates do you use? *

What kind of components do you use? What size? *

Is it common that you need to remove or replace a component after attachment? *

Are you familiar with Z-axis anisotropic materials? *

If so, tell me about your experience with anisotropic bonding?

About the new Bonding Process

Odoo image and text block

How it works

Our solution would be a paste that would be extruded onto the pads, directed by a Gerber paste file that you have uploaded onto PCB printer. It would be extruded using the paste head you already have.

After components have been placed onto the paste-loaded pads, the board is removed from the PCB Printer and placed into a specialized curing device. After 10 minutes of curing, the bond between the components and the traces is complete, exhibiting high strength (equivalent to off-the-shelf epoxies), high conductivity (<10 mOhm/sq) and flexibility. Conversely, the components will not be reworkable due to the high strength of the bonds.

But the most impressive thing is that the bond will only conduct in the z-axis, negating any shorts between pads that may occur as a result of the pasting process.

How often do you work with components that have hidden leads? (QFN, LGA), *

How often do you work with low temperature substrates? (ie: Plastics, Paper) *

What is the maximum allowable temperature of your substrates and/or components? *

Would you pay $5000 for this add-on? Please share your thoughts? *

Any other comments or questions?

Would you like to contacted by phone? *